Flex-Cored Type 所含助焊劑型號(hào)
Flex-Cored Type 所含助焊劑型號(hào)	Grade 等級(jí)
HJ#1	Water Soluble type 有機(jī)水溶性型
HJ#2/HJ#3/H1021	No Clean type 免洗型
HJ#529/607	RA type 活性松香型
HJ#6	Halide Free No Clean type 無(wú)鹵化物免洗型

Flex-Cored Type 所含助焊劑型號(hào)	Features 特性					Cleaning Methods 清洗方式
HJ#1	Water-soluble cored -flux for aqueous cleaning assemblies process.Excellent “Fast action"wetting property to enhance productivity. 水溶性，適合于水洗工序，潤(rùn)濕快，可以大大提高生產(chǎn)效率。					Water Clear 水洗
HJ#2/ HJ#3/ HJ#1021	Lowest and clear flux residue suited for most commercial no-clean hand soldring assemblies. Widely and most popular choice for assemblies requiring no-clean, clear residue characteristice. 無(wú)色透明，免洗，極少殘留物，適合于經(jīng)濟(jì)型的免洗手工焊接工序，是需要免洗和干凈殘留物的電子裝配商的最佳選擇。					No Clear 免洗
HJ#529	Fast wetting action RA cored-flux for consumer electronics assemblies. Flux residue is not corrosive nor conductive under normal condition of use.Cleaning not necessary for most consumer assmblies. 潤(rùn)濕快，活性強(qiáng)，適合于消費(fèi)性電子組裝行業(yè)，在普通使用條件下助焊劑殘留物無(wú)腐蝕，不導(dǎo)電，大多數(shù)消費(fèi)性電子組裝行業(yè)的使用者可免洗殘余物。					Bi-polar solvents 兩極性溶劑
HJ#607	Halide free with lowest and clear flux residue suited for no-cleanhand soldering assemblies. Exhibit fast wetting characteristics.Widely and most popular choice for assemblies requiring no-clean,clear residue characteristics.Suitable for use on different alloys. 無(wú)鹵化物，極少殘留物，適合于免洗手工焊接組裝。展現(xiàn)出快速濕潤(rùn)物性。免性，低殘留物的物性使其成為廣泛和最受歡迎的選擇。適合于多種不同合金。					No Clear 免洗

Characteristic of Cored flux   焊芯焊線的特性

Properties	HJ#1	HJ#2/ HJ#3/ HJ#1021	HJ#529	HJ#6	Test Method
Flux type 助焊劑類(lèi)型	Water Soluble	RMA No Clean	RMA No Clean	RMA No Clean	_
Class type*1 等級(jí)類(lèi)型	ORH1	ROL1	ROL1	ROL0	_
Halide Content (Mass %) 鹵化物含量(%)	≤2.000	≤0.100	≤0.440	0.00	JIS Z3197 8.1.4.2.1
Corrosion Test 腐蝕測(cè)試	NA	Pass	Pass	Pass	J-STD-004 IPC-TM-650 2.3.13
Acid Value 酸值	NA	190-210 Mg KOH/g	190-210 Mg KOH/g	208-228 Mg KOH/g	J-STD-004 IPC-TM-650 2.3.13
SurfaceInsulation Resistance*2SlR(Ω) 表面絕緣阻抗	≥1x109Ω After Cleaning	≥1x109Ω	≥1x109Ω	≥1x1011Ω	J-STD-004 IPC-TM-650 2.6.3.3
Spread Factor(%) 擴(kuò)散率	≥85	≥82	≥83	≥80	JISZ3197 8.3.1.1

*1 Class type (Halide content in Rosin Base Flux) according to the J-STD-004：ROL1=<0.5%
等級(jí)類(lèi)型(松香焊劑的鹵化物成份)依照J(rèn)-std-004：ROL0=0.0%，ROL1=<0.5%
*2 Surface lnsulation Resistance：Test Condition：85±2℃，85±2%; Conditioning Bias：+50V： Measurement Bias：+100V

表面電阻系數(shù)：測(cè)試條件：85±2℃，85±2%；條件編差：+50V：測(cè)量法偏差：+100V

Fluxcontent 助焊劑含量
1.0%~3.3%(Depends on application and diameter)視用途和線徑而定。

Diameter available 適用線徑
0.10mm~4.0mm(According to customer's requirement)依照客戶要求。

Packaging 包裝

Diameter(mm) 線徑	Net weight per spool (kg) 一卷凈重	No.spool per box 一盒卷數(shù)	Net weight per box (Kg) 一盒凈重
60.8-2.0	1	10 spool	10.00
0.5-0.7	0.5	10 spool	5
0.4	0.25	10 spool	2.5
0.3	0.25	10 spool	2.5
0.2	0.25	10 spool	2.5

Shelflife 有效期限
24 months from the date of manufacturing.
自生產(chǎn)日期開(kāi)始二十四個(gè)月內(nèi)。

Storage 貯存
To minimize the wires from further oxidation, ensure that the packaging is not damaged &the wires are not exposedto dust & other foreign materials.
為了減少錫錢(qián)受到氧化，確保包裝不破損，錫線不曝露于灰塵和其他物質(zhì)。

Delivery 交貨
Each order can be shipped with the certificate of analysis for each lot.
交貨同時(shí)附上分析證明書(shū)。

MaterialSafety DataSheet 材料安全數(shù)據(jù)單
A MSDS for this product can be request from our Sales personnel.
產(chǎn)品的MSDS可向銷(xiāo)售部索限。

Technical & Customer Service Support 技術(shù)&客戶服務(wù)
For more information our Lead free wires as well as our other products, please call, fax or email us. Our salesEngineers will be most glad to answer your enquires as well as recommend the most suitable product for yourapplication. Our Customer Service personnel are also available to provide you with our competitive quotation quotation as well as expedite your orders & provide you with any assistance you may require.
欲知無(wú)鉛錫線或我們其他的產(chǎn)品，請(qǐng)用電話、傳真或電郵給我們。我們的銷(xiāo)售工程師將很樂(lè)意的給予解答和介紹最適合您的用途的產(chǎn)品。我們的銷(xiāo)售工程師會(huì)提供您具競(jìng)爭(zhēng)力的服價(jià)，并盡快的交貨和提供您所需的協(xié)助。

Ultrafine Solder Wires 超細(xì)錫絲

Solder wires of different alloy with diameter varying from 0.1mm to 0.3mm are all available.
我公司可提供各種合金的Φ0.1mm-Φ0.3mm超細(xì)錫絲。

Ultra Low-Melting SolderWires 超低溫錫絲

Ultra low-melting wires such as BiPbSnln wire (melting point 87-94℃) and BiPblnSnCd wire (melting point 54-56℃) are considered to be the optimal choices for making fire detectors and alarms.
我公司超低溫錫絲適用于火災(zāi)探測(cè)器、溫度報(bào)警器等行業(yè)，主要有BiPbSnin和BiPbinSnCd等產(chǎn)品，其中BiPbSnIn熔點(diǎn)87-94℃，BiPbInSnCd熔點(diǎn)54-56℃。

High-Melting Lead-FreeSolderWires 無(wú)鉛高溫錫絲
Sn-Sb系 Sn-Sb Series
SnSb5 and SnSb10 wires, with melting point 245℃ and 245-255℃ respectively and working temperature from370℃ to 430℃, are widely used in the soldering of passive elements and small-scale IC, and will effectively help creating a solder joint with high reliability, good high-temperature strength and excellent corrosion resistance, thussuitable for the secondary package.
Sn-Sb 系錫絲主要有SnSb5、SnSb10，熔點(diǎn)分別為245℃、245-255℃,建議焊接溫度為370-430℃，主要應(yīng)用于被動(dòng)元件與小型集成電路的焊接。焊后焊點(diǎn)可靠性好、高溫強(qiáng)度高，抗腐蝕性能好，滿足二級(jí)封裝的焊接溫度要求。

Lead-freebelt無(wú)鉛錫帶
SnAaCu Fasten with basically has thickness of tin 0.05-0.15, are widely used in the soldering of passive elementsand small-scalelC.
SnAgCu系錫帶主要有厚度為0.05-0.15，主要應(yīng)用于被動(dòng)元件與小型集成電路的焊接。

SpecialSolderWires 特種錫絲
Parameters 產(chǎn)品參數(shù)

Products  產(chǎn)品	Melting Point 熔點(diǎn)(℃)	Shear Strength 剪切強(qiáng)度 (Mpa)	Tensile Strength 抗拉強(qiáng)度(Mpa)		Thermal Expansion Coefficient 熱膨脹系數(shù) (10-6/K)	Elongation 延伸率(%)	As-Cast 鑄態(tài)	Spreading Area 鋪展面積Cu (mm2/0.2mg)	Appearance 焊點(diǎn)外觀
			Proceeded 加工態(tài)	As-Cast 鑄態(tài)		Proceeded 加工態(tài)
SnBi58	139	48	48	48	15	46	54.3	60.5	光亮
SnBiCu1#	149-186	37.9	37.9	37.9	19.5	20	12.5	69.8	消光
SnBiCu2#	180-209	49	49	49	19	20	12.3	70.4	均勻、消光